Methods of operating die attach systems
US12288711B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Jan 3, 2023 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | Jan 3, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/95136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of operating a die attach system is provided. The method includes the step of providing a verification substrate configured to receive a plurality of die, the verification substrate including a plurality of substrate reference markers. The method also includes the step of imaging each of the plurality of die with respective ones of the plurality of substrate reference markers using an imaging system of the die attach system for determining an alignment of the plurality of die with the verification substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.