Semiconductor device package and method of fabricating the same
US12288738B2 · kind B2 · utility
1Cited by
1References
27Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 12, 2021 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | Apr 12, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a semiconductor device package and/or a method of fabricating the semiconductor device package. The semiconductor device package may include a semiconductor device including a plurality of electrode pads on an upper surface of the semiconductor device, a lead frame including a plurality of conductive members bonded to the plurality of electrode pads, and a mold between the plurality of conductive members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.