Integrated circuit devices
US12288788B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2021 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | Apr 16, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/8314
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device includes substrate including a fin-type active area extending on the substrate in a first direction parallel to an upper surface of the substrate, a first gate line crossing the fin-type active area on the substrate and extending in a second direction perpendicular to the first direction, a cut gate line extending in the second direction and being spaced apart from the first gate line with a first gate cut area therebetween, a second gate line extending in the second direction and being spaced apart from the cut gate line with a second gate cut area therebetween, and a power wiring disposed on the cut gate line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.