Power module and method for manufacturing same
US12288940B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2021 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | Jan 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10303
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a power module and a method for manufacturing same, the power module comprising: a ceramic substrate including a ceramic base and an electrode pattern formed on the upper and lower surfaces of the ceramic base; a PCB substrate disposed above the ceramic substrate and including an electrode pattern; a plurality of through-holes formed in at least one of the ceramic substrate and the PCB substrate; and a connection pin coupled to the through-holes and connecting the electrode pattern of the ceramic substrate and the electrode pattern of the PCB substrate to each other. The present invention has advantages in that it is easy to fix the connection pin to the ceramic substrate, the position accuracy of the connection pin is improved, and the convenience of assembly is increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.