Secondary side heatsink techniques for optical and electrical modules
US12288954B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2020 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | Sep 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.