Method for manufacturing mounting substrate, and component mounting device
US12289836B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2020 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | Oct 31, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0815
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a mounting board includes a first outer shape position acquisition step, a feature portion position acquisition step, a calculation step, a holding step, a second outer shape position acquisition step, and a mounting step. In the first outer shape position acquisition step, a first outer shape position of a component is acquired. In the feature portion position acquisition step, a position of a feature portion is acquired. In the calculation step, a deviation amount of the position of the feature portion with respect to the first outer shape position is calculated. In the second outer shape position acquisition step, a second outer shape position of the component is acquired. In the mounting step, the feature portion of the component is mounted to be positioned on a target position of a board based on the second outer shape position and the deviation amount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.