Process for localized repair of graphene-coated lamination stacks and printed circuit boards
US12289839B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 1, 2021 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | Jan 19, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Processes for localized lasering of a lamination stack and graphene-coated printed circuit board (PCB) are disclosed. An example PCB may include a lamination stack, post-lamination, that may further include a core, an adhesive layer, and at least one graphene-metal structure. A top layer of graphene of the graphene-metal structure may have never been grown before the lamination process or may have been removed post-lamination such that a portion of the top layer of graphene is missing. The localized lasering process described herein may grow (for the first time) or re-grow the graphene layer of the exposed portion of the metal layer without adverse effects to the rest of the lamination stack or PCB and while promoting a uniform layer of graphene on the top surface. A process of growing graphene through application of molecular layer and a self-assembled monolayer (SAM), are also described herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.