Chip on ceramics power module with low inductance and compact arrangement
US12289872B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 13, 2022 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | Aug 24, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20272
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Approaches, techniques, and mechanisms are disclosed for packaging electric power components. A power module comprises: a three-dimensional (3D) cooling structure that has a plurality of planar sides; a first set of mountable power components that are mounted on a first planar side in the plurality of planar sides of the 3D cooling structure; a second set of mountable power components that are mounted on a second planar side in the plurality of planar sides of the 3D cooling structure. The second planar side represents an opposing side, of the 3D cooling structure, to the first planar side. The 3D cooling structure includes an interior space containing one or more cooling channels in which cooling fluid is to flow. The interior space of the 3D cooling structure is spatially surrounded by other planar sides in the plurality of planar sides in combination with the first and second planar sides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.