Semiconductor devices
US12289881B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2022 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | Sep 28, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/251
Abstract
Provided is a semiconductor device including a conductive contact plug on a substrate, the conductive contact plug including a lower portion and an upper portion on the lower portion, the lower portion having a first width, and the upper portion having a second width less than the first width, a bit line structure on the conductive contact plug, the bit line structure including a conductive structure and an insulation structure provided in a vertical direction perpendicular to an upper surface of the substrate, and a first lower spacer, a second lower spacer, and a third lower spacer sequentially provided on a sidewall of the lower portion of the conductive contact plug in a horizontal direction parallel to the upper surface of the substrate, wherein an uppermost surface of the third lower spacer is higher than an upper surface of the first lower spacer and an upper surface of the second lower spacer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.