Connection apparatus, manufacturing method for connection device, and thermal management component
US12291079B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2021 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | Mar 10, 2042 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2500/18
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A connection apparatus, a manufacturing method of the connection apparatus, and a thermal management component are provided. The connection apparatus includes two or more plate bodies; the adjacent plate bodies are fixed and connected in a sealed manner; the connection apparatus is provided with a channel; at least one channel part is arranged in at least one of the adjacent plate bodies; the adjacent plate bodies define a channel at the channel part. One of the side walls of at least one plate body is provided with a mounting portion and/or a connecting portion along the axial direction or radial direction of the connection apparatus; the mounting portion is internally provided with a mounting hole for communication with the channel; the connecting portion is provided with a connecting hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.