Porous silicon material and method of manufacture
US12291457B2 · kind B2 · utility
0Cited by
30References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2024 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | Mar 4, 2044 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for forming a porous silicon material can include forming a mixture of silicon, carbon, and an etchant element, solidifying the mixture, removing the etchant element to form pores within the silicon material. The porous silicon material can include a distribution of pores with an average pore diameter between about 10 nm and 500 nm, wherein the silicon particle comprises a silicon carbon composite comprising 1-5% carbon by mass, 1-5% oxygen by mass, and 90-98% silicon by mass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.