Additive manufacturing employing solvent-free polyimide-containing formulations
US12291603B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Dec 27, 2018 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | Mar 3, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/0002
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Formulations usable in additive manufacturing, 3D inkjet printing in particular, of a three-dimensional object that contains a polyimide material, and additive manufacturing utilizing same are provided. The formulations contain a polyimide precursor (e.g., a bismaleimide) and an additional curable material, which is a multifunctional curable material, and are devoid of an organic solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.