Polyamide compounds, molds produced therefrom and use of the polyamide compounds
US12291638B2 · kind B2 · utility
0Cited by
45References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2021 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | Dec 15, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G69/26
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to polyamide compounds having high heat aging resistance which, in addition to a specific polyamide, comprise at least one unsubstituted or substituted metallocene, optionally at least one impact modifier and optionally at least one additive. The invention also relates to the use of said polyamide compounds for the production of molds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.