Adhesive bonding of beam and node assemblies
US12292077B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 4, 2023 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | Sep 8, 2043 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16B11/006
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An assembly and a method are provided for manufacturing a joined assembly. A method for manufacturing includes fitting together and datuming a beam and a node, wherein at least one of the beam and the node is formed with an aperture, and wherein a cylindrical interface is formed between the beam and node. Further, the method includes advancing a mechanical fastener through the aperture to temporarily hold the beam and the node in an engagement. Also, the method includes injecting a structural adhesive into the cylindrical interface between the beam and the node. The method includes final joining the beam and the node by curing the structural adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.