Apparatus and method for inspecting laser defect inside of transparent material
US12292387B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2021 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | Oct 11, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/8887
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for inspecting a transparent workpiece comprises: directing light from an illumination source onto a plurality of defects formed in the transparent workpiece, wherein the plurality of defects extends in a defect direction, wherein the transparent workpiece comprises a first surface and a second surface; detecting a scattering image signal from light scattered by the plurality of defects using an imaging system, wherein an imaging axis of the imaging system extends at a non-zero imaging angle relative to the defect direction, wherein entireties of at least a subset of the plurality of defects are within a depth of field of the imaging system; and generating a three-dimensional image of at least one of the plurality of defects based on the scattering signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.