Semiconductor chip and method for manufacturing the same
US12293945B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 30, 2022 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | Apr 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/6834
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip includes a chip constituent substrate having a first surface and a second surface, and including a layer containing gallium nitride. The chip constituent substrate is provided with a semiconductor element, and components constituting the semiconductor element are located more in an area adjacent to the first surface than in an area adjacent to the second surface. The chip constituent substrate is formed with a through hole penetrating the chip constituent substrate from the first surface to the second surface. The through hole defines a first opening adjacent to the first surface and a second opening adjacent to the second surface, and the first opening is larger than the second opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.