Package substrate and semiconductor structure with package substrate
US12293964B2 · kind B2 · utility
0Cited by
15References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 21, 2022 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | Sep 22, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/49816
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package substrate and a semiconductor structure with the package substrate are provided. The package substrate includes a body and a conductive layer. The body includes an opening region. The conductive layer is disposed at the opening region. The conductive layer includes a first conductive bridge and a second conductive bridge. The first conductive bridge and the second conductive bridge are disposed at intervals. The first conductive bridge is provided with at least one first via. The first conductive bridge and the second conductive bridge are disposed at intervals in the opening region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.