Conductive structure including copper-phosphorous alloy and a method of manufacturing conductive structure
US12293966B2 · kind B2 · utility
0Cited by
6References
19Claims
0Family size
Inventor
Key dates
| Filing date | Oct 24, 2023 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | Oct 24, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a method for forming a multilayer wiring structure, which includes: forming a patterned copper-phosphorous alloy layer over a carrier by performing a plating operation, and forming a dielectric layer over the patterned copper-phosphorous alloy layer. The forming the patterned copper-phosphorous alloy layer includes providing a plating solution having a copper source and a phosphorous source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.