3D printable feedstock inks for signal control or computation
US12293997B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2023 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | Nov 2, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0323
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a method for forming an electrically conductive ink able to be deposited through a print nozzle during a 3D printing operation. The method may involves providing an electrically non-conductive flowable material adapted to be flowed through a print nozzle during a 3D printing operation. A predetermined quantity of chiplets may then be mixed into flowable material, in accordance with a predefined percolation threshold, to form a percolating chiplet network within the polymer as the ink is flowed through the print nozzle and deposited on a surface. The chiplets each form an engineered electronic component, and ones of the chiplets randomly connect, in accordance with the predefined percolation threshold, to form an electrically conductive circuit having a predetermined circuit characteristic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.