Method for manufacturing light emitting device
US12294038B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2023 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | Apr 10, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing an electronic device is provided. The method for manufacturing the electronic device includes: providing a substrate with elements disposed thereon and transferring a portion of the elements from the substrate to a driving substrate, wherein transferring the portion of the elements from the substrate to the driving substrate includes: transferring the portion of the elements from the substrate to the driving substrate, which comprises illuminating regions of the substrate overlapped with the portion of the elements by an energy beam, wherein when the substrate is illuminated by the energy beam, the substrate and the driving substrate are separated by a gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.