Scalable cooling architecture for liquid and air cooling
US12295119B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2022 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | Sep 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/208
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Multiple systems and devices for providing liquid and air cooling for IT components is disclosed. The system includes a module comprising at least one dry cooler and at least one liquid heat exchange device. The module includes a primary cooling loop with the at least one dry cooler and the at least one liquid heat exchange device. The system also includes a secondary loop that includes the at least one liquid heat exchange device and one or more IT units in a facility. The system includes a path for air cooling the one or more IT units in the facility that includes at least one air intake from outside the facility that supplies air for cooling the one or more IT units.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.