Efficient thermal control system for microcircuit based on liquid metal coolant
US12295125B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2025 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | Jan 15, 2045 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An efficient thermal control system for microcircuits based on liquid metal coolant is provided, including a cooling water system, a liquid metal supply system and a cooling system. The liquid metal supply system is used for supplying liquid metal to the cooling system to achieve heat exchange with a chip through the liquid metal, and the cooling water system is used for cooling the liquid metal. The cooling system includes a cooling capacity distribution unit used for distributing the liquid metal; cabinets provided with chip cooling platforms, which are connected to the cooling capacity distribution unit through a pipe, and are provided with the chip; a temperature measuring component used for measuring temperature of the chips; and a control unit, and cooling capacity distribution unit and the temperature measuring component are electrically connected to the control unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.