Thermoelectric module and method for manufacturing the same
US12295264B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2022 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | May 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N19/101
Abstract
A thermoelectric module includes a stack structure of a plurality of insulating layers, a plurality of thermoelectric elements formed with the insulating layer interposed therebetween and including a first-type semiconductor device, a second-type semiconductor device, a first electrode connected to the first-type semiconductor device, a second electrode connected to the second-type semiconductor device, and a connection electrode connecting the first-type and second-type semiconductor devices, and a conductive via penetrating through the insulating layer to connect thermoelectric elements adjacent to each other, among the plurality of thermoelectric elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.