Low-cost and high-strength bi-based superconducting wire/tape and preparation method thereof
US12295269B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2024 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | May 3, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N60/855
Abstract
A low-cost and high-strength Bi-based superconducting wire/tape and a preparation method thereof, the preparation method includes: 1. subjecting a first Bi-based superconducting wire/tape to electrochemical silver reduction to remove a Ag alloy layer to obtain a second Bi-based superconducting wire/tape; and 2. subjecting the second Bi-based superconducting wire/tape to surface enhancement, such that a Cu layer is formed to obtain the low-cost and high-strength Bi-based superconducting wire/tape. An electrochemical silver reduction technology combines with an electrochemical additive method to remove a Ag alloy layer on a surface of a Bi-based superconducting wire/tape and coat a high-strength Cu layer, such that a low-cost and high-strength Bi-based superconducting wire/tape can be prepared, which reduces a preparation cost and improves a strength of a Bi-based superconducting wire/tape to meet the application requirements of large super-strong magnets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.