High frequency ultrasonic transducer and method of fabrication
US12296361B2 · kind B2 · utility
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11References
23Claims
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Key dates
| Filing date | Nov 29, 2018 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | Apr 20, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/853
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An ultrasonic transducer that includes a delay line, a piezoelectric element, and a metal conductive layer between the delay line and the piezoelectric element. The delay line and the piezoelectric element are acoustically joined with an atomic diffusion bond to facilitate coupling ultrasonic waves from the piezoelectric element into the delay line or from the delay line into the piezoelectric element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.