Method and apparatus for compacting a powder layer
US12296512B2 · kind B2 · utility
0Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2022 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | May 7, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present disclosure pertains to an improved method and apparatus for compacting a powder layer. An exemplary method comprises placing the substrate on a first plate, placing a second plate over the powder layer so that the substrate and the powder layer are sandwiched between the first plate and the second plate to form a multilayered structure comprising the first plate, the substrate, the powder layer and the second plate, and calendering the multilayered structure between a top calendering roller and a bottom calendering roller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.