Negative thermal expansion material, method for producing the same, and composite material
US12297123B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2023 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | Feb 24, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/22
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An object of the present invention is to provide a negative thermal expansion material having better negative thermal expansion characteristics. The present invention is a negative thermal expansion material, comprising copper vanadium composite oxide powder dissolving Al atoms and represented by the following general formula (1), CuxMyVzOt (1). In general formula (1), M represents a metallic element with an atomic number of 11 or more other than Cu, V, and Al, 1.60≤x≤2.40, 0.00≤y≤0.40, 1.70≤z≤2.30, 6.00≤t≤9.00, 1.00≤x+y≤3.00, and a molar number of the Al atoms in terms of atoms>a molar number of M atoms in terms of atoms if an M element is contained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.