Plated substrate
US12297542B2 · kind B2 · utility
0Cited by
0References
4Claims
0Family size
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Key dates
| Filing date | Aug 17, 2022 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | May 27, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A modified resin base material that includes a resin material having a base at a surface thereof, and a plating catalytic metal on the surface of the resin material, wherein a combination of the plating catalytic metal and the base is at least one of the following Lewis acid-base combinations according to a HSAB principle: a hard acid and a hard base or an intermediate base, an intermediate acid and a hard base, an intermediate base or a soft base, or a soft acid and an intermediate base or a soft base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.