Fiber board providing rigidity, sound reduction, and thermal insulation
US12297640B2 · kind B2 · utility
0Cited by
4References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2024 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | Aug 2, 2044 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2607/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A fiber board for a building structure is disclosed. The fiber board includes a fiber structure. The fiber structure includes a substrate fiber and a thermoplastic binder fiber. The substrate fiber is bound together by the thermoplastic binder fiber. The thermoplastic binder fiber makes up between 25 percent (%) and 35% by weight of the fiber board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.