Sensor deployment for modular pavement slabs
US12298194B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2022 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | Oct 24, 2042 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE01C2201/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pavement system includes a slab having a body comprising pavement materials presenting a top surface. The system includes a reinforcement layer comprising geogrid materials embedded in the body, strain sensors fixed to the reinforcement layer, and a processor configured to collect multiple electrical signals across time from each of the strain sensors and to analyze the electrical signals to determine one or more of: (A) risk of a structural defect in the slab, (B) risk of a problem with underlying sub-grade beneath the slab, and (C) movement of passing objects across the top surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.