Patent · US Active

Sensor deployment for modular pavement slabs

US12298194B1 · kind B1 · utility

0Cited by
2References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 24, 2022
Grant dateMay 13, 2025
Priority date
Expiry dateOct 24, 2042

Classification

  • Technology area (CPC E)Fixed Constructions
  • CPC primaryE01C2201/20
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A pavement system includes a slab having a body comprising pavement materials presenting a top surface. The system includes a reinforcement layer comprising geogrid materials embedded in the body, strain sensors fixed to the reinforcement layer, and a processor configured to collect multiple electrical signals across time from each of the strain sensors and to analyze the electrical signals to determine one or more of: (A) risk of a structural defect in the slab, (B) risk of a problem with underlying sub-grade beneath the slab, and (C) movement of passing objects across the top surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.