Thermal environment evaluation and compensation for computer components
US12298825B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2019 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | May 3, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2039
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The disclosure provides a cooling solution that evaluates the thermal environment of a computer component based on transient thermal responses of the computer component. The transient thermal responses are generated by measuring the temperature rise of the computer component over a designated amount of time for multiple “good” assemblies and multiple “bad” assemblies to determine a duration and allowable temperature rise needed to set a pass/fail criteria for different failure modes of cooling devices. A cooling device may not be operating as designed due to damage, needed maintenance, missing thermal interface material (TIM), improper installation, etc. From the transient thermal responses, a thermal problem, such as a malfunctioning fan, can be determined and a corrective action can be performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.