Method and apparatus for high resolution measurement of a workpiece
US12299909B2 · kind B2 · utility
0Cited by
6References
10Claims
0Family size
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Key dates
| Filing date | Oct 29, 2020 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | Oct 5, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30164
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods and systems are described herein for inspection of a workpiece, such as a honeycomb body. The methods and systems include collecting a plurality of images of the honeycomb body, extracting measurement data from each of the plurality of images, converting the measurement data extracted from each image into a common frame of reference, and combining the measurement data together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.