Leadless semiconductor package with internal gull wing lead structures
US12300586B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 15, 2021 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | Aug 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/182
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadless semiconductor package includes a plurality of internal gull wing leads forming a concave region and an IC die disposed in the concave region and having a plurality of conductive bumps at a first surface connected to corresponding proximal sections of the internal gull wing leads. Distal ends of the internal gull wing leads form surface mount pads at a mounting surface of the leadless semiconductor package for mounting the package to a circuit board. Packaging encapsulant extends between the mounting surface and an opposing surface of the package and encapsulates the first surface of the IC die and the proximal ends of the internal gull wing lead structures. In some implementations, the mounting surface further includes a second surface of the IC die opposite the first surface and thus a thermally conductive material may be disposed between the second surface of the IC die and the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.