Bonding device and method of manufacturing display device using the same
US12302738B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Feb 8, 2024 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | Feb 8, 2044 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1028
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A bonding device includes: a support in which a plurality of through-holes is defined, a diaphragm disposed on the support to cover the support, a pressing pad disposed on the diaphragm over a top surface of the support, and a window fixing chuck disposed on the pressing pad and in which a groove facing the pressing pad is defined. Here, the pressing pad includes a pad and at least one support bar disposed in the pad and extending in a first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.