Circuit board assembly soldering apparatus and circuit board assembly soldering method
US12303990B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2022 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Sep 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This application provides a circuit board assembly soldering apparatus and corresponding method. The soldering apparatus is provided with at least two bearing seats on a base plate, the bearing seats are located in a space between the base plate and a pressing plate assembly, the bearing seats each include a workbench, the workbench is located on a side of the bearing seat that faces the pressing plate assembly, a circuit board assembly is placed on the workbench. At least one adjustable bearing seat is provided, and a spacing between the workbench of the adjustable bearing seat and the base plate is adjustable. Further, a spacing between the workbench of the adjustable bearing seat and the pressing plate assembly is adjusted, to implement soldered connection between circuit board assemblies with different thicknesses, and the soldering apparatus can connect at least two circuit board assemblies by soldering at a single time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.