Laser processing system using Bessel beam and method for processing workpiece using Bessel beam
US12303999B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2021 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Aug 3, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/56
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing system according to an embodiment of the present invention includes: a laser unit emitting a laser beam; an optical unit disposed on a propagation path of the laser beam and modulating the incident laser beam into a Bessel beam; a stage on which a workpiece to be processed with the Bessel beam emitted from the optical unit is mounted; and a control unit for controlling the operations of the laser unit, the optical unit, and the stage, wherein the optical unit is configured to position the focus line of the emitted Bessel beam on the workpiece and to move the focus line positioned on the workpiece with a predetermined range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.