Polyamide composition

US12305022B2 · kind B2 · utility

Assignee

• Evonik Operations GmbH · DE

Inventors

• Kathrin Salwiczek · Recklinghausen, DE
• Chenyu Ye · Shanghai, CN
• Urs Welz-Biermann · Mannheim, DE
• Klaus Hülsmann · Haltern am See, DE
• Fei Teng · Qingdao, CN
• Zhisheng Wang · Shanghai, CN
• Juan Guo · Beijing, CN

Key dates

• Filing date: May 9, 2020
• Grant date: May 20, 2025
• Expiry date: Jun 13, 2042

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L77/02
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A polyamide composition contains a) 88.5-98 wt. % of at least one aliphatic polyamide, wherein at least one monomer unit has 10 to 14 carbon atoms, and wherein the aliphatic polyamide is semi-crystalline; and b) 2-11.5 wt. % of an S glass fiber. The weight percentages of a) and b) are based on a total weight of the polyamide composition. The polyamide composition contains neither a polyolefinic impact modifier nor a core-shell modifier. A moulding material containing the polyamide composition is useful, and a moulded article can be produced from the moulding material. A shoe outsole containing the polyamide composition is also useful.