Multiaxial thermal dissipation and structurally-compliant device
US12306455B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 2023 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Dec 7, 2043 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF17C2270/0509
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
An apparatus includes a Dewar having an endcap. The apparatus also includes a heat sink and a multiaxial thermal shoe having a thermal interface material and configured to thermally couple the endcap of the Dewar to the heat sink via one of at least two axial surfaces. The multiaxial thermal shoe is configured to transfer thermal energy between the endcap of the Dewar and the heat sink without structurally coupling the Dewar to the heat sink. The multiaxial thermal shoe may be configured to hold the thermal interface material against the endcap. The multiaxial thermal shoe may couple to the heat sink via a first axial surface in-line with an optical centerline or a second axial surface crosswise to the optical centerline.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.