Optical device manufacturing method and manufacturing apparatus using local etching
US12306533B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2021 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Nov 11, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12104
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical device manufacturing method and an optical device manufacturing apparatus using local etching are characterized in that in a wafer process of manufacturing a waveguide type optical device including a light-propagating core and a cladding, a nozzle which locally performs etching processing is used for movement, and a slanted end surface at an arbitrary angle, an end surface having a curved shape, or a core having a varying film thickness is formed in an arbitrary position on the wafer. A slanted end surface is formed at an optical waveguide end using local etching, for example, a 45° reflective mirror, a light-condensing nonplanar reflective mirror, or a film thickness controlled core is implemented, and high-efficiency optical connection is realized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.