Method for measuring stitching overlay accuracy of image sensor stitching manufacturing
US12306547B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2022 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Dec 9, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present application discloses a method for measuring stitching overlay accuracy of image sensor stitching manufacturing, forming an A-type overlay pattern mark and a corresponding B-type overlay pattern mark on the edge of each rectangular pixel area to be stitched; after the A-type overlay pattern mark and the B-type overlay pattern mark are stitched and exposed, performing metrology by means of a scanning electron microscope to obtain dimension features; and according to the dimension features of the A-type overlay pattern mark and the B-type overlay pattern mark stitched together and exposed and measured by the scanning electron microscope, determining stitching overlay accuracy of two adjacent rectangular pixel areas. The present application can achieve direct metrology on the overlay pattern mark on the stitched pixel area of a product, facilitating timely and accurate monitoring on the stitching overlay accuracy of image sensor stitching manufacturing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.