Coil electronic component and method of manufacturing the same
US12308150B2 · kind B2 · utility
0Cited by
20References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2020 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Jan 6, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2017/048
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A coil electronic component includes a magnetic body that includes a substrate and a coil part. The coil part includes patterned insulating films disposed on a surface of the substrate and a plating layer formed between the patterned insulating films by plating and having a thickness greater than or equal to its width measured parallel to the surface of the substrate. The plating layer may be formed in a single plating operation, and may have a thickness of 200 μm or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.