High density coil design and process
US12308157B2 · kind B2 · utility
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26References
8Claims
0Family size
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Key dates
| Filing date | Nov 11, 2022 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Nov 11, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.