Core package, double-substrate multilayer solid aluminum electrolytic capacitor and method for preparing same
US12308182B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2024 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Oct 11, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G9/15
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A core package includes N cores, N+1 hollow-square-shaped thin plates, a first substrate and a second substrate. The N+1 hollow-square-shaped thin plates and the N cores are stacked alternately to form a semi-finished core package. Anode portions of adjacent two cores are electrically connected, and cathode portions of adjacent two cores are electrically connected. When stacking the N+1 hollow-square-shaped thin plates and the N cores, a space where the N+1 hollow-square-shaped thin plates are not in contact with the N cores is filled with an insulating adhesive. A double-substrate multilayer solid aluminum electrolytic capacitor includes a resin shell, a waterproof coating and the core package. This application also provides a method of preparing the double-substrate multilayer solid aluminum electrolytic capacitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.