Electronic device and manufacturing method thereof
US12308296B2 · kind B2 · utility
0Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2021 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Oct 16, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/214
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a connecting element. The connecting element includes a first conductive line segment, a second conductive line segment, and a first connecting line segment. The first conductive line segment is electrically connected to the second conductive line segment through the first connecting line segment. In a vertical projection direction, the first connecting line segment has a first height, the first conductive line segment has a second height, and the first height is different from the second height.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.