Terahertz band waveguide module and mounting method of IC chip
US12308510B2 · kind B2 · utility
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7Claims
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Assignee
Inventor
Key dates
| Filing date | Dec 22, 2022 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Jan 7, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q23/00
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Disclosed are a terahertz band waveguide module and a mounting method of an IC chip. The terahertz band waveguide module includes: a waveguide having a channel having a first size based on an E-plane; and an IC chip having a width of a second size and disposed at a preset position inside the waveguide, wherein the IC chip is disposed inside the waveguide with an air gap on at least two surfaces of the IC chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.