Structure for optimal XPU socket compression
US12308543B2 · kind B2 · utility
0Cited by
25References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2022 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Jul 22, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1053
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An assembly includes a printed circuit board (“PCB”). An aperture extends through the PCB. The assembly also includes an array of pins and a processor package. The array of pins extends around a perimeter of the aperture, and the processor package extends over the aperture. The processor package is pressed against the array of pins by a compressive force couple.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.