Modular quantum interconnect for microwave and telecommunications wavelengths
US12308889B2 · kind B2 · utility
0Cited by
0References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2023 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Dec 23, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P7/00
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A quantum interconnect module includes a quantum memory that has a dual arm interferometer embedded therein. The dual arm interferometer has a first arm within a crystal and a second arm within the crystal. The interferometer is coupled to a photon source. A microwave resonator has a waveguide coupled to a microwave source. The microwave resonator is coupled to the first arm of the quantum memory. The interferometer generates an output based on the microwave source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.