Methods of making metal patterns on flexible substrate
US12309939B2 · kind B2 · utility
0Cited by
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10Claims
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Key dates
| Filing date | Feb 29, 2024 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Feb 29, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0769
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods of making metal patterns on flexible substrates are provided. A releasable solid layer is selectively formed on a patterned surface of the flexible substrate by applying a liquid solution thereon. The releasable solid layer is transferred from the patterned surface to a transfer layer where the metal patterns are formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.