Circuit board
US12309941B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2021 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Oct 16, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09736
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board according to an embodiment comprises: an insulating layer including first to third regions; an outer layer circuit pattern disposed on the upper surface of the first to third regions of the insulating layer; and a solder resist including a first part disposed in the first region of the insulating layer, a second part disposed in the second region, and a third part disposed in the third region, wherein the outer layer circuit pattern has a first height, the third part of the solder resist is disposed on the upper surface of the outer layer circuit pattern to have a second height, the first region includes a first sub-region and a second sub-region, the first part includes a first sub-part disposed in the first sub-region and a second sub-part disposed in the second sub-region, the upper surface of the first sub-part is located to be higher than the upper surface of the outer layer circuit pattern and lower than the upper surface of the third part, the upper surface of the second sub-part is located to be lower than the upper surface of the outer layer circuit pattern, and the surface roughness of the third part of the solder resist is different from the surface rough…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.