Full-reflection display substrate, manufacturing method thereof and full-reflection display device
US12310104B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2021 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Feb 19, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D10/821
- WIPO fieldFood chemistry
- WIPO sectorChemistry
Abstract
The present disclosure provides a full-reflection display substrate, a manufacturing method thereof and a full-reflection display device. The full-reflection display substrate includes: a base substrate, the base substrate including a display region and a non-display region; a signal line arranged in the display region; a bonding pin arranged in the non-display region, coupled to the signal line and bonded to a driving circuitry; a reflection layer arranged in the display region; and an etch stop pattern arranged at a same layer and made of a same material as the reflection layer, arranged in the non-display region, and at least covering a side surface of the bonding pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.